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LTM8023
ABSOLUTE MAXIMUM RATINGS
(Note 1)
V IN , RUN/SS Voltage .................................................40V
ADJ, R T , SHARE Voltage .............................................5V
V OUT , AUX .................................................................10V
PGOOD, SYNC ..........................................................30V
BIAS ..........................................................................16V
PIN CONFIGURATION
V IN + BIAS .................................................................56V
Internal Operating Temperature
(Note 2).................................................. –40°C to 125°C
Storage Temperature.............................. –55°C to 125°C
Solder Temperature............................................... 250°C
GND (BANK 3)
SHARE R T
ADJ
GND (BANK 3)
SHARE R T
ADJ
7
SYNC
7
SYNC
6
5
4
3
V OUT
(BANK 2) 2
1
PGOOD
RUN/SS
BIAS
AUX
V IN
(BANK 1)
6
5
4
3
V OUT
(BANK 2) 2
1
PGOOD
RUN/SS
BIAS
AUX
V IN
(BANK 1)
A
B
C
D
E
F
G
H
A
B
C
D
E
F
G
H
LGA PACKAGE
50-LEAD (11.25mm × 9mm × 2.82mm)
T JMAX = 125°C, θ JA = 21.7°C/W, θ JCbottom = 9.6°C/W,
θ JCtop = 26.5°C/W, θ JB = 9.2°C/W, WEIGHT = 0.9g
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
ORDER INFORMATION
BGA PACKAGE
50-LEAD (11.25mm × 9mm × 3.42mm)
T JMAX = 125°C, θ JA = 22.8°C/W, θ JCbottom = 11.2°C/W,
θ JCtop = 16.2°C/W, θ JB = 10.8°C/W, WEIGHT = 0.9g
θ VALUES DETERMINED PER JEDEC 51-9, 51-12
PART NUMBER
PAD OR BALL FINISH
PART MARKING*
DEVICE FINISH CODE
PACKAGE
TYPE
MSL
RATING
TEMPERATURE RANGE
(Note 2)
LTM8023EV#PBF
LTM8023IV#PBF
LTM8023MPV#PBF
LTM8023EY#PBF
LTM8023IY#PBF
LTM8023IY
LTM8023MPY#PBF
LTM8023MPY
Au (RoHS)
Au (RoHS)
Au (RoHS)
SAC305 (RoHS)
SAC305 (RoHS)
SnPb (63/37)
SAC305 (RoHS)
SnPb (63/37)
LTM8023V
LTM8023V
LTM8023MPV
LTM8023Y
LTM8023Y
LTM8023Y
LTM8023Y
LTM8023Y
e4
e4
e4
e1
e1
e0
e1
e0
LGA
LGA
LGA
BGA
BGA
BGA
BGA
BGA
3
3
3
3
3
3
3
3
–40°C to 85°C
–40°C to 85°C
–55°C to 125°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–55°C to 125°C
–55°C to 125°C
Consult Marketing for parts specified with wider operating temperature
ranges. *Device temperature grade is indicated by a label on the shipping
container. Pad or ball finish code is per IPC/JEDEC J-STD-609.
? Terminal Finish Part Marking:
www.linear.com/leadfree
? Recommended LGA and BGA PCB Assembly and Manufacturing
Procedures:
www.linear.com/umodule/pcbassembly
? LGA and BGA Package and Tray Drawings:
www.linear.com/packaging
8023fi
2
For more information www.linear.com/LTM8023
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